Automotive

Advanced Microsystems for Automotive Applications 2000 by E. Mounier, S. Leroy, M. Waga (auth.), Dr. Sven Krüger,

By E. Mounier, S. Leroy, M. Waga (auth.), Dr. Sven Krüger, Wolfgang Gessner (eds.)

Microsystems are an incredible good fortune consider the auto undefined. which will fulfil the shoppers' requests for safeguard comfort and automobile economic climate, and to meet environmental standards, microsystems have gotten imperative. therefore a good number of microsystem purposes got here into the dialogue. With the foreign convention AMAA 2000, VDI/VDE-IT offers a platform for the dialogue of all MST correct elements for automobile functions. The convention lawsuits assemble the papers by means of authors from car providers and manufacturers.

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In this array , two fields are pres sure sensitive and two fields act as a reference. Th e differential capacitive signal is converted into a digit al bitstream by a Sigma Delta Modul ator. Th e complete Iinearisation, offset-, sensitivity- and temperature compen sation is perform ed in the digital dom ain. The resulti ng signal is either con verted back to an analogue ratiometric output (KP120) or can be prov ided as digital interface directly to a controller (SPI interfac e in KPlOO). With the digital interface the controller can activate features like self-diagnosis even for specific sensor parts (See functi onal block diagram / Fig .

W . Specks , M . Strecker and geometry. Thi s combines the advantages of a high volume fabrication in a clean room enviro nment with a high degree of mechani cal t1exibility . Th is allows a cost optimisation for a given applicat ion. The assembled connector modul e is show n in Fig . 3 . Th e housing is covered on the top by a plastic lid and on the bottom by an aluminium heat spreader. Lid and heat spreade r are attac hed to the inn er connector lead frame by a snap- in techniq ue, ensu ring an easy assembly .

3 . 4 Production Flow After completion of front-end processes, the chip is tested. First calibration is done on wafer level. In this calibration step the offset is calibrat ed (KPIOO) or calibration behaviour of offset , gain and temperature compensation is tested (KP120) . As a next step , the chips are assembl ed in a fully automatic line in the PDSOF- 8 package . At the end of the assembl y line , the final calibration is perform ed in the packag e . This is achieved by programming the integrated low pow er fuses.

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